Three Dimensional Integrated Circuits (3D ICs) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections.

The global Three Dimensional Integrated Circuits (3D ICs) market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

North American market for Three Dimensional Integrated Circuits (3D ICs) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.

Asia-Pacific market for Three Dimensional Integrated Circuits (3D ICs) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.

The key global companies of Three Dimensional Integrated Circuits (3D ICs) include TSMC, STMicroelectronics, Intel, Micron Technology, Xilinx, STATS ChipPAC, UMC, Tezzaron Semiconductor and SK Hynix, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Three Dimensional Integrated Circuits (3D ICs), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Three Dimensional Integrated Circuits (3D ICs).

The Three Dimensional Integrated Circuits (3D ICs) market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Three Dimensional Integrated Circuits (3D ICs) market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Three Dimensional Integrated Circuits (3D ICs) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.


By Company


TSMC

STMicroelectronics

Intel

Micron Technology

Xilinx

STATS ChipPAC

UMC

Tezzaron Semiconductor

SK Hynix

IBM

Samsung

ASE Group

Amkor Technology

Qualcomm

JCET


Segment by Type


Through-Silicon Via (TSV)

Silicon Interposer

Through-Glass Via

Others


Segment by Application


Consumer Electronics

Industrial

IT and Telecommunication

Healthcare

Military and Defense

Automotive

Others


Production by Region



North America

Europe

China

Japan

South Korea


Consumption by Region


North America

U.S.

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

China Taiwan

Southeast Asia

India

Latin America

Mexico

Brazil

Core Chapters

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Three Dimensional Integrated Circuits (3D ICs) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Three Dimensional Integrated Circuits (3D ICs) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Three Dimensional Integrated Circuits (3D ICs) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: The main points and conclusions of the report.